⚖ Comparatif : Raspberry Pi Compute Module 3+ (CM3+ / CM3+ Lite) vs Raspberry Pi Compute Module 4 (CM4, 2020) — Fiche carte
Comparatif des caractéristiques techniques déclarées : Raspberry Pi Compute Module 3+ (CM3+ / CM3+ Lite) et Raspberry Pi Compute Module 4 (CM4, 2020) — Fiche carte (17 caractéristiques). Voir la fiche complète : Raspberry Pi Compute Module 3+ (CM3+ / CM3+ Lite) · Raspberry Pi Compute Module 4 (CM4, 2020) — Fiche carte.
| Caractéristiques | Raspberry Pi Compute Module 3+ (CM3+ / CM3+ Lite) | Raspberry Pi Compute Module 4 (CM4, 2020) — Fiche carte |
|---|---|---|
soc | Broadcom BCM2837B0 — the revised silicon of the Raspberry Pi 3 Model B+ (same part as the Pi 3B+), quad-core Arm Cortex-A53 (ARMv8-A), capped at 1.2 GHz on the module (datasheet §1 and §10 "maximum working frequency of 1.2 GHz"; CNX launch article notes the B0 die can reach 1.4 GHz on the 3B+ board but is limited to 1.2 GHz here by the module power supply). | Broadcom BCM2711 — quad-core Cortex-A72 (ARM v8-A, 64-bit) @ 1.5 GHz, same silicon as Raspberry Pi 4 Model B; VideoCore VI GPU, OpenGL ES 3.x, H.265/HEVC 4Kp60 decode, H.264 1080p60 decode / 1080p30 encode. (CM4 datasheet RP-008168-DS, downloaded 2026-10-13; launch post) |
gpu | Broadcom VideoCore IV (docs model table, introduction.adoc). | — |
ram | 1 GB LPDDR2 (the only option; datasheet §1). | 1 / 2 / 4 / 8 GB LPDDR4-3200 — the datasheet specifies the SDRAM "with ECC". (CM4 datasheet §1.2; Product Brief) |
storage | on-module eMMC 8/16/32/64 GB on non-Lite variants; eMMC I/O voltage is fixed at 1.8 V and the eMMC signals are NOT accessible on module pins. CM3+ Lite exposes SDX_CLK/CMD/D0–D3 + SDX_VDD (1.8–3.3 V) instead (datasheet §1, §3 block diagram, §5 pin table). | on-module eMMC 0 / 8 / 16 / 32 / 64 GB, peak bandwidth 100 MB/s — "four times faster than previous Compute Modules"; eMMC is wired to the primary SD-card interface, so modules with eMMC cannot use an external SD card / external eMMC (SDIO 2.0 connector exists only for CM4Lite). (CM4 datasheet; Wikipedia) |
connectivity | No Wi-Fi, no Bluetooth, no Ethernet, no PCIe on the module. Full peripheral list on the 200-pin edge connector: 48× GPIO, 2× I2C, 2× SPI, 2× UART, 2× SD/SDIO, 1× HDMI 1.3a, 1× USB 2.0 host/OTG, 1× DPI (24-bit parallel RGB), 1× SMI (NAND/Intel-mode-80 bus), 4-lane + 2-lane MIPI CSI (up to 1 Gbps/lane each), 4-lane + 2-lane MIPI DSI, composite TV-out (TVDAC), JTAG/Debug (VC_TCK/TMS/TDI/TDO/TRST_N) (datasheet §2.2, §5, §9). | — |
gpio | 48 usable lines in two independently powered banks — bank0 GPIO0–27 (GPIO0-27_VDD) and bank1 GPIO28–45 (GPIO28-45_VDD); each bank rail sets that bank's I/O level anywhere from 1.8 V to 3.3 V and must be powered even if unused. Weak internal pulls 50–65 kΩ on all but GPIO28/29/44/45 (no default pull — add off-chip pulls); default drive 8 mA, max 16 mA/pin, ≤50 mA aggregate per bank. Alternate functions include PWM0/1, GPCLK0–2, PCM (I2S), SPI1/2, UART1/2 (datasheet §6 tables, §9.1, Tables 7–8). No ADC and no DAC on the SoC (only the composite video DAC). | 28 GPIO signals supporting 1.8 V or 3.3 V signalling (per-bank VGPIO_VREF tied to either rail — Pi 4B is 3.3 V only), breakout: up to 5 × UART, 5 × I²C, 5 × SPI, 1 × SDIO, 1 × DPI, 1 × PCM (I²S), 2 × PWM, 3 × GPCLK. Default GPIO drive strength 4 mA (configurable 1–8 mA), internal pulls typ. 47 kΩ. The SoC's Bank 2 pins (8 of 54) are reserved on-module for eMMC, HDMI hot-plug and ACT LED/USB-boot control and must not be used. (CM4 datasheet §1.2, §3.3; Peripheral Software Guide, GitHub mirror, retrieved 2026-10-13) |
mechanical | 200-pin DDR2-SODIMM form factor, JEDEC MO-224 (mechanically compatible with standard DDR2 SODIMM sockets, not electrically); 67.6 × 31 mm (CNX launch article); max component height 1.2 mm underside / 2.5 mm top, PCB 1.0 ±0.1 mm (datasheet §4). Electrically identical and (apart from a higher CPU z-height) physically identical to CM3 (datasheet §1). | — |
power | six mandatory supplies: VBAT (core SMPS, 2.5–5.0 V), 3V3 (±5 %), 1V8 (±5 %), VDAC (2.5–3.3 V; clean 2.5–2.8 V only if TV-out used, else tie to 3V3), GPIO0-27_VDD and GPIO28-45_VDD (1.8–3.3 V), plus SDX_VDD on Lite. Minimum supply capability: VBAT ≥ 3500 mW, 3V3/1V8 ≥ 250 mA each, VDAC ≥ 25 mA, GPIO banks ≥ 50 mA each (datasheet §7, Tables 5–6). | single +5 V input; absolute maximum VIN 6.0 V (stress rating); controlled by GLOBAL_EN (chip-enable: shutdown current 15 µA when low, ~8 mA with GLOBAL_EN high but software-idle); idle ≈ 400 mA typical, operating ≈ 1.4 A typical at 5 V (≈ 2–7 W); on-module +3.3 V and +1.8 V regulators can each back-feed 600 mA to carrier-board loads. Power-up sequencing pins: GLOBAL_EN, RUN_PG, nRPI_BOOT, EEPROM_nWP. (CM4 datasheet §3.3, §5.1–5.4, §6.1) |
typical_consumption | — | |
temperature | nominal operating range −25 °C to +80 °C (limited by the eMMC and LPDDR2 parts); DVFS thermal throttling engages when the on-die sensor exceeds 80 °C (datasheet §10, §10.1). Note: the CNX launch article lists −20 to +70 °C — the datasheet (Release 2, 30/06/2026) is authoritative here. | — |
form_factor | — | 55 mm × 40 mm × 4.7 mm, 4 × M2.5 mounting holes, I/O via two 100-pin high-density connectors (one power/low-speed, one high-speed) — a deliberate compatibility break with the JEDEC DDR2-SODIMM outline of CM1/CM3/CM3+. (CM4 datasheet; launch post) |
networking | — | on-module Gigabit Ethernet PHY supporting IEEE 1588 (time-sensitive networking; the PHY needs an external transformer/magnetics on the carrier); optional wireless module Cypress/Infineon CYW43455 ("BCM43455") — dual-band 2.4/5.0 GHz 802.11b/g/n/ac + Bluetooth 5.0 / BLE, with on-board PCB antenna, electronic antenna switch to an external U.FL antenna, and per-rail disable pins WL_nDisable / BT_nDisable. Wireless carries modular compliance certification to cut product certification cost. (CM4 datasheet §2.1–2.2; launch post + James Adams staff comment confirming BCM43455; Product Brief) |
pcie_usb | — | 1 × PCIe 1-lane host, Gen 2 (5 Gb/s) — the lane the Pi 4B spends on its USB 3 controller is exposed to the carrier board (NVMe, extra NICs, etc.); 1 × USB 2.0 high-speed port only (no USB 3 on CM4). (CM4 datasheet §1.2, §2.3–2.4; Wikipedia CM4 section) |
video_display | — | dual HDMI 2.0 (up to 4Kp60), 2-lane + 4-lane MIPI DSI, 2-lane + 4-lane MIPI CSI-2, plus 1 × DPI parallel RGB display on GPIO — more display/camera interfaces than any flagship board. (CM4 datasheet §1.2; Product Brief) |
no_adc_dac_no_on_module_rtc_no_audio_jack | — | — none appear in the datasheet feature list; the CM4IO carrier adds a battery-backed RTC socket. (CM4 datasheet §1.2; CM docs CM4IO section) |
thermal | — | BCM2711 throttles to stay under 85 °C; operating range −20…+85 °C (extended variants −40…+85 °C); RF performance optimal only to +75 °C; datasheet warns the module "may run warmer than the Raspberry Pi 4 Model B" because the smaller PCB provides less passive heat sinking. MTBF (ground benign) 377 000 h (382 000 h for CM4Lite). (CM4 datasheet §3.2; Product Brief) |
carrier_io_board | — | the official CM4 IO Board (160 × 90 mm) provides 2 × HDMI, 2 × USB 2.0, GbE RJ45 with PoE header, PCIe Gen 2 x1 socket, microSD slot (Lite only), 2 × DSI + 2 × CSI FPC, 40-pin HAT footprint, RTC battery socket, 12 V barrel input (up to 26 V if PCIe unused), selectable 1.8/3.3 V GPIO, and eMMC-flash jumpers. CM4 mounts on CM5IO (reduced features) and CM5 mounts on CM4IO (reduced features). (CM docs CM4IO section, retrieved 2026-10-13) |
Raspberry Pi Compute Module 3+ (CM3+ / CM3+ Lite) Raspberry Pi Compute Module 4 (CM4, 2020) — Fiche carte